Abstract
AbstractA simulated interconnect/contact/cathode/cathode support test cell is fabricated to investigate the effectiveness of the high‐entropy alloy as the contact material on the microstructure and the performance of the converted spinel‐based layer. Although the CuMnNiFeCo alloy powder is selected as the contact precursor, it showed good sinterability after sintering at 900°C for 2 h in air. The electrical performance of the contact layer is evaluated by the area‐specific resistance measurement, including isothermal exposure and thermal cycling. The compatibility of the contact layer with adjacent components is investigated through observing the cross‐sectional view of the test cell. Furthermore, the effectiveness of the contact layer in inhibiting Cr migration is also assessed.
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