Abstract
Abstract As part of a controlled, step-wise development program, silicon cells from an early production run were assembled into packages and installed in a prototype electrical module. After three years field service, the module was disassembled and the cell packages were examined in detail. Although all 48 cell packages were still functional, significant cracking was discovered in the solder layers between ceramic stand-offs and copper heat-spreaders. A simplified analysis of thermal fatigue as a cyclic creep process predicts useful lives of about twelve years for cell packages of this configuration and solder joint thickness.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
