Investigation of germanium films and GeSi interface structure by transmission electron microscopy

Abstract

Abstract The structure of germanium films (d≌0.3 μm) evaporated onto a silicon substrate and the GeSi interface have been investigated by transmission electron microscopy (TEM). Ge was evaporated in a vacuum of approximately 10−6 Torr onto (111) Si. Epitaxial growth was observed at substrate temperatures Ts>500°C. The films grown at Ts = 520°–600°C (low temperature epitaxy) were characterized by a high density of stacking faults (SF), microtwin lamellae and dislocations which lay normal to the film surface. In this case the interface dislocations were regular and the dislocation density was equal to (3–4)×1010 cm−2. At Ts = 700°–850°C (high temperature epitaxy) few stacking faults were discovered. Dislocations in the interior of the film formed three-dimensional networks as a result of interactions of different slip systems and dislocation climb. The formation of misfit dislocations was apparent at the interface. The region Ts = 630°–700°C is an intermediate region.