Investigation of exhausts from fabricated silicon micronozzles with rectangular and close to rotationally symmetric cross-sections

Abstract

Close to rotationally symmetric in-plane silicon micronozzles with throat and exit diameters of 45 and 260 µm, respectively, have been fabricated using semi-isotropic SF6 etching through an array mask utilizing microloading and reactive ion etching lag. Comparison with nozzles fabricated using deep reactive ion etching (DRIE) and having a rectangular cross-section but a similar hydraulic diameter in the throat, showed that the Reynolds numbers were almost equal even though the DRIE-etched nozzle had an almost five times larger cross-sectional area, hence implying less viscous losses and higher efficiency with the nearly symmetrical nozzles. The nozzle shapes have been studied using x-ray computed tomography. Comparison of the nozzles' exhaust jets using schlieren imaging, showed that the rectangular nozzles' jets deviate from the nozzle axis direction. It is believed that it is caused by the inclined side walls resulting from the DRIE etching. The results from intentionally misaligning the wafers, each containing half a nozzle, 50 µm parallel with or perpendicular to the nozzle axis, showed that the exhaust deviated and widened, respectively. The findings show that the nozzle symmetry affects both the shape and the pointing direction of the exhaust and that schlieren imaging is a powerful tool for determining nozzle thrust vector deviations.