Abstract
Switching dynamics and current flow homogeneity under very-fast TLP (vf-TLP) stress is investigated in smart power and CMOS technology ESD protection devices by means of optical transient interferometric mapping (TIM) techniques with sub-nanosecond time resolution. Comparison between the device behavior under vf- and conventional TLP stress is discussed. The sub-ns time resolution enables a detailed insight into the triggering behavior of protection elements.
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