Abstract

The gravimetric inspection of co-electrodeposited copper, with hard inert second phase ceramics SiC and 0.02 M [CuCl2.2H2O] in 1 ChCl: 2 EG, based liquid for different solution-phase loadings of 1-3 \(\mu\)m silicon carbide unpolished gold AT cut working electrode placed in’Vertical’ position, revealed that the EQCM method admits the first in-situ quantification or particulate inclusion. It was found that the composition of incorporated substance was fairly dependant on the concentration of second phase particles in solution, where in this study the 5% SiC has the amount in the copper which is in a good agreement with alumina particles with the same size. Another observation was that most of the material was drawn onto the surface rather than settling on to it, however the distribution of the hard phase was found to be reasonably even throughout the coating. This technology is important because it assists deposition of bright copper coatings without adding hazard materials, such as cyanide. On the other hand the comparison between concentrations of 0.02 M and 0.2 M [CuCl2.2H2O] in 1 ChCl: 2 EG based liquid for 10% solution-phase loadings of 45-55 nm size silicon carbide was also investigated, where the working electrode is placed in’Horizontal’ postion. It is very interisting that the experimental result showed that the mass loaded by 0.2 M solution is about 10 times greater than for the mass loaded by 0.02 M solution.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.