Abstract
In this study, we demonstrate and investigate a new droplet injection design. We create a thermal inkjet (TIJ) printhead using an application-specific integrated circuit system and bulk micromachining technology (microelectromechanical systems). We design inkjet printhead chips with a new structure and investigate their properties. For the new structure, the integration of complementary metal-oxide-semiconductors (MOSs) and enhancement-mode devices, as well as power switches and a TIJ heater transducer, enables logic functions to be executed on-chip. This capability is used in the proposed design to address individual jets with even fewer input lines than in matrix addressing. A high number of jets (at least 896) can be addressed with only 11 input lines. E1 (Enable 1) and E2 (Enable 2) are set up dependently, and they have the ability to reverse their signals in relation to each other (i.e., if E1 is disabled, E2 is enabled and vice versa). The E1 and E2 signals each service 448 jets. If one of the MOSs is turned on, then it corresponds to a power line with a similar function. If an addressing gate terminal of the other MOS has a discharge action, then we can control a different heater to generate heating bubbles in the jet inks. The operating frequency for addressing these measurements is 18 kHz in normal mode, 26 kHz in draft mode, and 16 kHz in best mode.
Highlights
Inkjet printers generally use electro-thermal bubble-jet technology, in which an electrical pulse heats a small ink tank until bubbles in the ink are squeezed out
This paper presents a thermal bubble-jet inkjet printhead wafer system, which can be implemented using platform-coating technology
The travel time for the whole liquid droplets to be molded into ink ones to spray on paper is 40 μs for onAe hsmeaatertr. bUusbinbglet-hjeits nperwintdhreivade mwoidthe, atheloinngkjeltifceasnpajent twheasliqpuriodpdorsoepdleatsndat adesmpeoendsthriagtheedr. tThahne 2m6ukltHipzl.eTxehre parbiinlitthyetaodsienletecgt rdaitfefedreinnkt jpeot wnoezrzoluetaprurtasyiss tthhreoluagtehstbmotehthsotadnidnairndkcjeotmmpalcehminenesta. rIyn oMthOeSr (CMOS) processes and micromachining technology
Summary
Inkjet printers generally use electro-thermal bubble-jet technology, in which an electrical pulse heats a small ink tank until bubbles in the ink are squeezed out. The shortcoming of this method is that the rapid heating, expansion, and compression of the ink expel it onto the printing paper, forming unwanted dots on the printing objects. Inkjet technology increases the stability of the droplet color to achieve both high-speed and high-quality printing [1–6], in which the ink droplets have uniform size and shape, and the consistency of the ink concentration enhances the image quality. Thermal inkjet (TIJ) printing forces the ink into a tiny capillary. To date, increasing the inkjet ejection frequency requires an increase in the number of holes and heaters on a single printhead
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