Abstract

AbstractScanning capacitance microscopy (SCM) often shows a change in contrast at grain boundaries [1-3]. The origins of this contrast and the efficacy of SCM as a tool to identify band bending at grain boundaries in pc-Si and mc-Si are discussed. Contrast at these grain boundaries could be influenced by different oxide growth rates or by defect states at the oxide interface. In order to determine the influence of such mechanisms on the SCM signal, such effects must be modeled; we show that a simple one-dimensional model agrees well with more detailed models of SCM signal strength and indicates, for example, that very small changes in oxide thickness measurably affect the SCM signal. In our experimental data, the uniformity and quality of the oxide layer are confirmed, and increased contrast consistent with depletion regions is still observed at higher order grain boundaries as identified by electron backscattering diffraction, including 9 and 27a. Scans of the SCM signal as a function of dc probe voltage allow such regions to be more quantitatively investigated.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.