Abstract
A method for determining the depth distribution of ion-implanted impurity atoms in semiconductors is developed. The method consists in measuring the concentration of impurities by X-ray fluorescence analysis upon the ellipsometry controlled removal of thin semiconductor layers. It is found that the prolonged low-energy X-ray radiation exposure of an ion-implanted semiconductor layer leads to a change in the distribution profile of the ion-implanted impurity atoms.
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Schedule a callMore From: Journal of Surface Investigation: X-ray, Synchrotron and Neutron Techniques
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