Abstract
Smoothing additives are the necessary component of copper plating electrolytes. Choice of the required additive is determined by the type of electrolyte and its pH values. Studies of adsorption behavior of such compounds in electrolytes with different acidities are of current interest. Adsorption activity of poly-N, N'-dimethylsafranine and poly-N, N'-diethylsafranine on the copper electrode in sulfate electrolytes was established in the present work. The dependencies of the differential capacitance of the double electric layer of the copper electrode on the potential which were obtained in acidic (pH 1.7) and neutral (pH 5.9) electrolytes indicate that acidity of the medium has a significant effect on the additive adsorption. The studied organic substances show high adsorption activity in an acidic solution. The likely cause of the established phenomenon in an acid medium is transition of these organic compounds to a protonated state with formation of positively charged amino groups. Cationic groups of the additives are responsible for an additional interaction with the cathode surface and provide stronger adsorption of poly-N, N'-dimethylsafranine and poly N, N'-diethylsafranine on the copper electrode in comparison with a neutral sulfate electrolyte. Poly-N, N'-diethylsafranine with its molecular weight higher than that of poly-N, N'-dimethylsafranine is characterized by higher adsorbability. Since the smoothing effect of additives in electrodeposition of copper coatings is determined by their adsorption properties, it should be expected that the most effective in this process will be the use of poly-N, N'-diethylsafranine at lower pH values of the copper plating electrolytes.
Highlights
Adsorption of organic compounds is widely used to control the processes of metal electrodeposition
The adsorption behavior of such smoothing additives to copper plating electrolytes as poly-N, N’-dimethylsafranine and poly-N, N’-diethylsafranine which are compounds containing quaternary cations and amino groups was studied for the copper electrodes
Adsorption of additives was studied by measuring differential capacitance of the double electric layer
Summary
Adsorption of organic compounds is widely used to control the processes of metal electrodeposition. Surface-active substances can increase the electrolyte dissipation capacity, provide deposition of compact coatings with good adhesion to the substrate. The surfactants used should change the conditions of electrocrystallization of metals by adsorption on their surface This method of modifying structure and morphology of the electroplated coating surface has found a wide application in obtaining electrolytic copper deposits. The issues related to the influence of surface-active substances on the kinetics and the mechanism of copper electrodeposition have been debatable until now. All of this hinders development of modern surfactant compositions ensuring directional control of the process of electrodeposition of copper coatings. Identification of specific features of interaction of the surfactants used in electrodeposition of copper coatings with the copper electrode surface is a relevant task
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