Abstract
With the miniaturization and deep integration of electronics, the challenges associated with high-power heat dissipation technology have increased. Combining the features of jet cooling technology and microchannel cooling technology, a hybrid two-layered channel-jet heat sink is designed for general consumer CPUs. The heat sink performance is investigated experimentally. Since the CPU generation power is 120 W, the heat sink can control the CPU excess temperature below 60 °C with an air volume less than 20 m3/h and a pressure drop less than 20 Pa. The different geometric parameters of the heat sink are numerically calculated. Increasing the channel width and reducing the channel height and slot length can enhance the heat transfer but also increase the pressure drop. Orthogonal tests are employed to optimize the design by evaluating the performance of various heat sink structures. The performance evaluation criterion (PEC) is selected as the evaluation index. Under standard conditions with a cross-sectional airflow velocity of 1.5 m/s, the optimal structure is a 2 mm channel width, 12 mm channel height and 50 mm slot length.
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