Abstract

The urgent requirement for high reliability and increasingly miniaturized electronic devices necessitates packaging polymers with giant dielectric constant (ε′), low loss and high breakdown strength (Eb). To significantly restrain the dielectric loss and leakage current of molybdenum (Mo)/poly (vinylidene fluoride, PVDF) while still holding a large ε′, the silica (SiO2) encapsulated Mo core@shell structured particles were prepared in this work utilizing a sol-gel method, and then composited with PVDF to explore the silica shell's impact and regulating effect on the dielectric properties of the PVDF composites. The findings on the relationship between microstructure and dielectric properties showcase that the introduced SiO2 interlayer not only enhances the interface interactions but also mitigates the great interfacial mismatch in both ε′ and conductivity between the two components, resulting in elevated Eb of the composites. Moreover, the dielectric loss and conductivity of the composites can be remarkably reduced because the silica shell introduces deep traps inhibiting the passage of long-distance electron migration. And the overall dielectric properties of the Mo@SiO2/PVDF can be effectively tuned by modifying the Mo@SiO2's electric resistivity and optimizing the shell thickness. This work provides a beneficial strategy for the design and preparation of dielectric composites with superior dielectric performances for prospective applications.

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