Investigation and Optimization of a Cooling System Prototype for a Module of the Silicon Tracking System for the BM@N Experiment

Abstract

Various materials were tested for use in the elements of the cooling system for the readout electronics of the BM@N silicon tracking detector. The thermal design was performed using the ANSYS software package and the thermal conductivities of various adhesives and carbon-fiber composites were experimentally measured. The results were used to select materials for cooling fins. Thermal tests of the prototypes of front-end-board boxes have been carried out, during which various thermal interfaces were also tested.