Abstract

The preparation of metal–ceramic layered composites remains a challenge due to the incompatibilities of the materials at the high temperatures of the co-firing process. For densification, the ceramic thick-film materials must be subjected to high-temperature annealing (usually above 900 °C), which can increase the production costs and limit the use of substrate or co-sintering materials with a low oxidation resistance and a low melting point, such as metals. To overcome these problems, the feasibility of preparing dense, defect-free, metal–ceramic multilayers with a room-temperature-based method should be investigated. In this study, we have shown that the preparation of ceramic–metal Al2O3/Al/Al2O3/Gd multilayers using aerosol deposition (AD) is feasible and represents a simple, reliable and cost-effective approach to substrate functionalisation and protection. Scanning electron microscopy of the multilayers showed that all the layers have a dense, defect-free microstructure and good intra-layer connectivity. The top Al2O3 dielectric layer provides excellent electrical resistance (i.e., 7.7 × 1012 Ω∙m), which is required for reliable electric field applications.

Highlights

  • Thick-film multilayer technology is of great value in the electronics industry

  • A schematic representation and a photograph of the multilayer structure are shown in Figure 1a,b, respectively

  • The Al2 O3 layer was deposited on top of the Al layer, keeping certain areas free to allow for electrical connections

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Summary

Introduction

Thick-film multilayer technology is of great value in the electronics industry. It enables the development and design of a wide variety of products, such as microsystems, electronic circuit boards and micro-electromechanical systems. A hightemperature firing process can be avoided by using aerosol deposition (AD), which is a room-temperature spray-coating method for producing dense, micrometre-thick films. It requires dry powders of approximately micrometre-sized particles that are mixed with a carrier gas to form an aerosol [3]. The high density of the deposited materials is achieved by the hammering effect of powder particles colliding with the surface of the substrate, fragmenting and re-bonding [4,5,6] This deposition mechanism is referred to as a room-temperature, impact-consolidation mechanism [6]. AD is a unique approach to the deposition of ceramic coatings at room temperature, which means the vast majority of research has been conducted on ceramic coatings, such as simple oxides (Al2 O3 [7], TiO2 [8], Y2 O3 [9]), perovskites (Pb(Zr,Ti)O3 [10], BaTiO3 [11])

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