Abstract
Metallic foils are crucial to many applications ranging from printed circuit boards, aviation, aerospace, packaging, photovoltaics to batteries. In these applications they are often part of multifunctional composites, for which mechanical integrity is a prerequisite for the functionality. To ensure precise simulations and lifetime prediction, exact numerical material models are needed. In this work, material parameters of the Lemaitre-Chaboche model were fitted for electrodeposited copper foils. By using nanoindentation and microstructural characterisation, good agreement with literature was achieved. Additionally, it was found that the Tabor rule to estimate yield stress from indentation may not be applicable for metallic foils.
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