Interphase/interface modification on the dielectric properties of polycarbonate/poly(vinylidene fluoride‐co‐hexafluoropropylene) multilayer films for high‐energy density capacitors

Abstract

ABSTRACTUnique three‐component multilayer films with ATBTATBTA configuration were fabricated using forced assembly multilayer coextrusion for novel dielectric systems. The dielectric breakdown strength, displacement–electric field hysteresis, and dielectric spectroscopy of 65‐layer polycarbonate (PC)/tie/poly(vinylidene fluoride‐co‐hexafluoropropylene) (P(VDF‐HFP)) were investigated with various tie materials. Three different tie materials, poly(methyl methacrylate) (PMMA), styrene‐co‐acrylonitrile copolymer with 30% acrylonitrile content (SAN30), and poly(ethylene terephthalate‐co‐1,4‐cycohexanedimethylene terephthalate) (PETG) were chosen owing to their various degrees of interaction with either P(VDF‐HFP) or PC. The 65‐layer PC/PMMA/P(VDF‐HFP) films exhibited a 25% enhancement in breakdown properties, 50% higher energy density, 40% smaller hysteresis loop areas, and orders of magnitude slower ion migration relative to the 33‐layer PC/P(VDF‐HFP) control. These property improvements are mainly attributed to the localized interactions at PMMA/P(VDF‐HFP) and PMMA/PC interfaces, forming interphase regions. The modified PMMA/P(VDF‐HFP) interphase region can effectively hinder the migration of impurity ions in P(VDF‐HFP), reducing their mobility within the layer. Additionally, a small fraction of PMMA can lead to slightly increased dielectric constant of the composite films owing to strong interaction between PMMA and P(VDF‐HFP). The other two systems with PETG and SAN30 as tie layers exhibited marginal improvements in dielectric properties owing to their weaker interactions with the P(VDF‐HFP) layers. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2013, 51, 978–991