Interphase modeling of copper‐epoxy particulate composites subjected to static and dynamic loading

Abstract

AbstractIn this investigation, the static and dynamic behavior of copper‐filled epoxy particulate composites has been experimentally studied. The influence of particle‐weight fraction (0–25%), on the static behavior and filler concentration, temperature and frequency on the dynamic behavior of the mentioned particulate composites was thoroughly studied. Experimental results for the static three‐point bending modulus were compared with respective theoretical predictions derived from that existing in literature semiempirical models. Results were also compared with predictions derived by the application of the interphase model previously developed by the first author for the evaluation of the elastic modulus in particulate composites, taking into account the effect of filler‐matrix adhesion. It was found that the predicted values as derived from the application of the interphase model were in better agreement with experimental findings when compared with respective predictions derived from other models. Polymer‐filler degree of adhesion was also studied by applying the Turcsànyi model. Extended SEM investigations and DMA tests were also made to support both experimental and theoretical findings. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008