Abstract
Epoxy Mold Compounds (EMC) are used to protect integrated circuits (IC) from environmental influences, with one of these influences being moisture ingress, causing corrosion. To obtain the needed thermal and mechanical properties EMCs require a high loading of (silica) fillers, introducing a large amount of interface. While silane coupling agents promote good binding, they have shown to introduce an interphase volume that exhibits a faster moisture transport between epoxy and SiO2 in glass fiber filled epoxy. In this work, we investigate if such an interphase volume is also introduced by the filler particles in EMC and if it influences the moisture diffusion coefficient of the composite. We compare moisture uptake measurements performed by dynamic vapor sorption (DVS) with predictions from effective medium theory, as well as with numerical simulations based on micro-CT scans of our samples for a model epoxy system containing different filler levels and commercial EMC samples with two different filler levels. From the measured DVS data, we observe an effective diffusion coefficient, that is higher than predicted for an absence of any interphase for both the EMC and the model system. This suggests that an interphase layer should be present.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
