Abstract

There can have been few periods in the history of the electronics soldering industry when the introduction of new technologies was so widespread and prevalent. Many of these changes have the objective of improving the efficiency of the process, and examples of this might be nitrogen soldering and the new developments in reflow soldering. Other changes, however, are being forced upon the industry by the impact of environmental legislation, and examples in this case include the ban on the use of CFCs and the growing pressure to replace lead‐containing solders with non‐toxic alternatives. The content of the soldering session reflected these concerns, with papers on nitrogen soldering, developments in reflow soldering and environmental issues.

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