Abstract
We report experimental investigations of the structure of dense patterns obtained during electrochemical deposition of copper in thin cells. The deposit correlation function reveals the periodic structuration of the patterns but shows that the primary spacing is not steady during the growth and that moreover it is not simply related to the diffusion length. Another measurable quantity is the occupancy ratio of the fingers in the cell. Its variation as a function of the experimental parameters is interpreted from specific properties of electrochemical growth. The results are discussed with respect to the well-known behavior of cellular solidification fronts.
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