Abstract
The internal stress of electroless nickel and cobalt films on silicon single crystals was measured as a function of thickness and experimental conditions. The internal stress was measured using an interference technique to determine the bending produced by films in the thickness range of 500–5,000Aå The stress was found to be tensile and isotropic for both metals. The stress in electroless nickel films is greater than in similar cobalt films. The stress decreases with thickness which is in contrast to vacuum evaporated nickel and cobalt films which exhibit a stress independent of thickness.
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