Abstract
This paper presents a case study of an intermittent audio failure analysis of a remote speaker-microphone module for a two-way radio. A root cause analysis was undertaken to identify probable causes of the intermittent failure, followed by a series of experiments to determine the strength and the intermittent audio failure load of cable components and the fully assembled cable. The combined experimental and finite element results demonstrated that the main contributor of the intermittent audio failure was the micro surface cracks on the copper conductor strands. In addition, the combination of the component materials and design of the cable have also contributed to the non-uniform state of residual stress induced in the copper conductors which have reduced the ability of the copper conductors to withstand the normal handling load under the influence of micro surface cracks.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
