Abstract

This paper deals with the analysis of boost interleaved DC-DC converter with a coupled inductor on the same magnetic core. The advantage of the coupled inductor over the non-coupled case is investigated. The ripple current equations as an input current for the boost operation mode and the ripple current in individual phase of the interleaved converter using coupled inductor are explained analytically, supported by simulation and experimental results. The novelty of the paper is an investigation of current ripples of interleaved boost converter operated over 50% of duty ratio and utilization of the converter in the application of electrically driven vehicle.

Highlights

  • Nowadays, the interleaved topologies are widely used due to their advantageous properties, such as lowered current ripple and volume reduction [1], [2], [3], [4], [5], [6], [7], [8] and [9].For higher power applications, there are more possibilities how to perform higher power density regarding the efficiency of the converter

  • From Eq (3), Eq (11) and Eq (16), it is evident that input current ripple is the same (except the negative sign in Eq (16)) under the condition that leakage inductance Llk is equaled to non-coupled inductance L

  • Using the high value of the coupling coefficient, the leakage inductance is almost zero. It leads to increasing of the input current ripple ∆Iin, but the ripple of the phase current ∆IL1 or ∆IL2 is minimized

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Summary

Introduction

The interleaved topologies are widely used due to their advantageous properties, such as lowered current ripple and volume reduction [1], [2], [3], [4], [5], [6], [7], [8] and [9].For higher power applications, there are more possibilities how to perform higher power density regarding the efficiency of the converter. The interleaved topologies are widely used due to their advantageous properties, such as lowered current ripple and volume reduction [1], [2], [3], [4], [5], [6], [7], [8] and [9]. This converter includes only one inductor and two half-bridge legs connected in parallel. This is done for reasons of obtaining higher current ratings, thermal improvements, and sometimes for redundancy. If losses are not shared, the thermal differences among the devices will lead to other problems and pos-

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