Abstract
Mo/Si multilayers with a period thickness of ∼ 7.5 nm have been fabricated by e --beam evaporation in UHV at a deposition temperature of 150°C [1]. At their interfaces interlayers of mixed Mo and Si are obtained which are thicker at the Mo-on-Si than at the Si-on-Mo interface. The composition of as-deposited Mo/Si multilayers and bilayers and changes in the composition after baking the samples have been studied with high-resolution RBS. Differences in the behaviour of the two interfaces with baking are observed. The interdiffusion of Mo and Si starts mainly at the Mo-on-Si interface. The thickness of the interlayer at the Mo-on-Si interface increases with baking temperature. With the increasing thickness the Si/Mo mixture in the interlayer changes from Mo-rich to Si-rich. After baking at temperatures higher than 600°C strong Si diffusion into Mo is observed for both interfaces.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
