Abstract
AbstractThe effects of rapid oxidation and overcoat diffusion processes on the intergranular coupling and grain isolation in thin Co films were studied. The oxidation process was found to be strongly temperature dependent. The optimal coercivities can only be achieved within a narrow range of temperatures, while further increasing the temperature incurs significant thermal instability. CrMn underlayers were confirmed to be more effective in enhancing the grain isolation by the grain boundary diffusion during the oxidation process. The oxidation process does not change the Co anisotropy, and hence the coercivity increase is appears to be a result of better grain isolation. The in-situ diffusion of Ag and Cr overcoats were also found to have siginificant effects on the grain isolation in Co and CoCr films.
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