Interfacial Reactions of Sn, Sn-3.0Ag-0.5Cu, and Sn-9Zn Lead-Free Solders with Fe-42Ni Substrates

Abstract

Interfacial reactions between Sn, Sn-3.0 wt.%Ag-0.5 wt.%Cu (SAC), and Sn-9 wt.%Zn (SZ) lead-free solders and Fe-42 wt.%Ni (alloy 42) substrates at 240°C, 255°C, and 270°C were investigated in this study. FeSn2, (Fe,Ni, Cu)Sn2, and (Ni,Fe)5Zn21 phases were formed, respectively, at the interface in the Sn/alloy 42, SAC/alloy 42, and SZ/alloy 42 couples. As the reaction time and temperature were increased, the layered intermetallic compound (IMC) assumed two distinct structures, i.e., a thicker layer and a pillar-shaped IMC, in all couples. The IMC thickness of these couples increased with the increase of reaction time and temperature. The IMC thickness was also proportional to the square root of the reaction time. The interfacial reaction mechanism of these couples was diffusion controlled.