Abstract
A new ternary solder alloy Sn62Bi32Ga6 (in wt.%) with melting point of 128°C, which is 10°C lower than that of eutectic Sn-Bi, has been developed. The composition was obtained by adding the maximum possible amount of Ga without causing Ga segregation and the formation of a liquid phase inside the solder. Solders were reflowed on Cu substrates to investigate their interfacial morphologies during liquid reactions. The only intermetallic compound detected at the interfaces was CuGa2, which initially formed with a discrete basin type at the interfaces. As the reflow time was increased, the basin-type compound formed a continuous layer that inhibited Cu dissolution. Solid-state aging tests were also performed on the system, and the activation energy for the formation of CuGa2 was found to be 2.82 kJ/mol, which is much lower than that of the Cu-Sn compound.
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