Abstract
A reaction study of Cu x Ni y alloy (x = 0.2–0.95) under bump metallization (UBM) with Sn-Ag-zCu solder (z = 0–0.7) was conducted. Formation and separation of intermetallic compounds (IMCs), effect of Cu addition to the Cu x Ni y alloy and the solders, and compatibility of reaction products with currently available phase diagrams are extensively investigated. The increase of Cu content both in the Cu x Ni y alloy and in the solder promoted IMC growth and Cu x Ni y consumption; though, with regard to solder composition, the reverse trend was true of the solder reactions in the literature. The liquid + Cu6Sn5 area in the Sn-rich corner needs to be larger compared to the currently available Cu-Ni-Sn ternary phase diagram, and the maximum simultaneous soluble point of Ni and Cu in Sn needs also to be moved to the Ni-Sn side (e.g., Sn-0.6Cu-0.3Ni).
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