Abstract
Interfacial reactions between Sn and Cu-xAg alloys (x = 0 at.%, 11.1 at.%, 33.3 at.%, and 50 at.%) were investigated. The as-prepared Cu-Ag alloys displayed a microstructure composed of a proeutectic (Cu) phase and a eutectic (Cu) + (Ag) structure, where the fraction of the eutectic structure increased with increasing Ag content. At 200°C and 250°C, reactions to form Cu6Sn5 and Cu3Sn phase occurred at the Sn/Cu-Ag interface, and also inside the Cu-Ag substrate along the (Ag)/(Cu) interphase interface. The penetrated growth behavior by way of the (Ag)/(Cu) interphase interface accelerated the growth rate of the intermetallic compounds and the consumption of the Cu-Ag substrates. A comparison between conventional Sn/Cu and Sn/Cu-Ag systems indicated that addition of Ag to Cu had a significant accelerating effect on the Sn/Cu-xAg interfacial reaction to form Cu6Sn5.
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