Abstract
A novel composition of Cu–Pd–V filler alloy was designed for the joining of Cf/SiC composite. The filler alloy was fabricated into brazing foils with a thickness of 0.15mm by a rolling process. The alloy′s wettability on the Cf/SiC composite was studied with the sessile drop method. After heating at 1473K for 10min the Cu–Pd–V filler alloy showed a low contact angle of 6° on the composite. A VC0.75 reaction band was formed at the surface of the Cf/SiC composite under the brazing condition of 1443K /10min, and the microstructure in the central part of the joint was composed of (Cu, Pd) solid solution and eutectic-like phase of Pd2Si+Cu3Pd. The interfacial reaction mechanism is discussed. The room-temperature three-point bend strength of Cf/SiC–Cf/SiC joints brazed with Cu–Pd–V filler alloy at 1443K for 10min is 128MPa, and the joint strengths at temperatures of 873–1073K are even higher than the room-temperature strength. The presence of refractory Pd2Si compounds within the joints should contribute to the stable high-temperature joint strengths.
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