Abstract
The utilization of a very thin Ni metallization in the Au/Ni/Cu facilitates faster diffusion of Cu to the solder interface. The out-diffusion of Cu during an aging period changes the chemistry and morphology of the Au-containing intermetallic compounds (IMCs) at the interface. This study suggests that (Au,Ni)Sn4 has a lower interfacial energy with Ni3Sn4, whereas AuSn4 has a higher interfacial energy with (Cu,Ni)6Sn5. However, both (Au,Ni)Sn4 and AuSn4 have lower interfacial energies with Pb.
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