Abstract
Hot dip tin coating was obtained on AZ91D magnesium alloy surface, and interfacial reactions between Sn coating and electroless Ni-P plating was studied. The results show: after 220±5°C, 2h diffusion, the intermetallic compounds possessed corresponding thickness, and Ni3P layer along the interface acted as a good diffusion barrier between Sn and Ni. When Ni3Sn4 spread to the surface, microcracks were observed on the surface. Corrosion resistance of Ni(P)-Sn coating before and after diffusion was investigated with polarization curves. The results show: Ni(P)-Sn coating significantly enhance the corrosion potential of base material, but after the Ni3Sn4 growth to the surface, it caused electrochemical corrosion and decreased the corrosion resistance.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
