Abstract
The increasing operation temperature of electronic devices significantly accelerates the growth of Cu-Sn intermetallic compounds (IMCs) at the interfaces of Sn-Ag solder/Cu substrate which deteriorates the device reliability. A robust diffusion barrier is thus required to suppress the interfacial reactions between solders and substrates. In this work, electroless Ni-Fe-P coatings with three different internal microstructure were prepared to compare their interfacial reactions and diffusion barrier properties in Sn-Ag solder interconnects. Ni-Fe-P coatings can effectively suppress the excessive growth of interfacial IMCs in Sn-Ag solder interconnects during reflow process. It has been found that the Ni-Fe-P coatings with crystalline structure had great influence on IMCs formation and morphology at Sn-Ag/Ni-Fe-P interfaces. Among three types of Ni-Fe-P coatings, the crystalline Ni-Fe-P exhibited the optimal diffusion barrier property owing to the presence of a uniform and thinnest FeSn2 layer at the interface, while the amorphous Ni-Fe-P coating was less effective due to the irregular and thickest Ni3Sn4 IMCs formed at the interface.
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