Abstract
Abstract The interfacial reaction, change of intermetallic compound (IMC) morphology and shear strength of Sn–0.7 wt.% Cu solder/Ni joints were investigated during reflow at 255°C for times of up to 20 min. Up to the reaction time of 1 min, a needle-type (Cu,Ni)6Sn5 IMC with a hexagonal cross-section was formed. After reflow for 5 min, the (Ni,Cu)3Sn4IMC started to form under the (Cu,Ni)6Sn5 IMC. After prolonged reflow time, the upper (Cu,Ni)6Sn5 IMCs detached from the interface. Also, the morphology of the (Cu,Ni)6Sn5 IMC changed from needle type to dodecagonal type with increasing reflow time. In the ball shear test, the shear strength did not change significantly as a function of the reflow time. The result of the shear test indicated that the shear strength of the Sn–0.7Cu/Ni ball-grid array solder joint was not significantly related to the thickness and spalling phenomenon of the IMCs formed at the interface.
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