Abstract
Sn–Bi solder is considered a promising lead-free solder which meets the performance requirements with the advantages of low melting point, good wettability and mechanical properties. The interfacial reaction and mechanical properties of Sn58Bi-XCr (X = 0, 0.1, 0.2, 0.3) composite solder joints have been studied. After isothermal aging treatment at 100 °C, the microstructure and reaction mechanism of the interface were analyzed. The results show that the microstructure of Sn58Bi composite solder joint with 0.2wt.% Cr element is obviously refined. At the same time, the average thickness of the interface intermetallic compounds (IMCs) becomes thinner with the addition of Cr content. In addition, the tensile strength of Sn58Bi composite solder joint decreases gradually with the extension of aging time, but the tensile property of Sn58Bi-0.2Cr is better than that of other alloy components. However, with the extension of aging time, the shear strength of Sn58Bi composite solder joints generally decreases at first and then increases, and the fracture morphology of solder joints changes from brittle fracture mechanism to ductile fracture mechanism.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
