Abstract
In this study, wetting tests for Ni substrate with eutectic Ga-Sn-Zn are carried out using the sessile drop method. The experiments are performed for 1, 10 and 30 days of contact, at temperatures of 100°C, 150°C and 250°C. Selected liquid/substrate couples are cross-sectioned and subjected to scanning electron microscopy with energy dispersive spectroscopy for interfacial microstructure investigation. Phase identification is carried out using synchrotron x-ray diffraction. The growth of the intermetallic Ni-Ga phase layer is studied at the liquid/Ni substrate interface, and the kinetics of the formation and growth of this layer are determined.
Highlights
The miniaturisation of electronics which generate a large amount of heat calls for more efficient cooling systems.[1]
The aim of this study is to demonstrate the effect of time and temperature on the kinetics of the formation and growth of the intermetallic layer at the interface of liquid eutectic Ga-Sn-Zn and Ni substrate
Taking into account the possible applications of Ga-based liquid metals in the electronics industry, wetting tests were carried out to show the interfacial phenomena between eutectic Ga-Sn-Zn alloy and Ni substrate
Summary
The miniaturisation of electronics which generate a large amount of heat calls for more efficient cooling systems.[1]. Taking into account their thermal conductivity, the proposed liquid metals have attractive characteristics as heat transfer fluids for high power (Received November 2, 2018; accepted June 5, 2019; published online June 17, 2019)
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