Abstract

This work evaluates the temperature field, stresses, and peeling loads in thermal barrier coatings (TBCs) with air holes subjected to cyclic thermo-mechanical loads during a complete flight. Analytical formulae for the steady-state temperature field and interfacial peeling loads are developed considering thermal gradients in the thickness and longitudinal directions. In addition, viscoplasticity finite element modelling is conducted for the mechanical behaviors of the TBC system. A unified Chaboche-Lemaitre constitutive model that combines a power flow rule with non-linear anisothermal evolution of isotropic and kinematic hardening is integrated into the numerical framework. The results show tensile peeling stress and shear stress are generated in the vicinity of the hole, which motivates the initiation and propagation of hole-edge cracks. The maximum peeling and shear stresses locate close to the thermally grown oxide/bond coat interface and they increase with increasing hole radius. The interfacial peeling moment and shear force could characterize edge cracking in TBCs. As the hole radius increases, the interfacial peeling moment and shear force increase quickly when the hole radius is less than 1 mm but remain stable when the hole radius is beyond 2 mm. This work not only helps to explain the failure mechanisms of hole-edge delamination and spallation in TBCs but also guides the design of thermal barrier coated hot-section components in gas turbines.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.