Abstract

To minimize moisture-related failure in electronic packages, it is important to develop a better understanding of reliability study at a fundamental level. Molecular dynamics simulations were conducted and the MD results showed that the moisture seepage along the EMC/Cu interface is more prevalent when compared to bulk moisture diffusion. This diffusion path is believed to be a dominant mechanism causing moisture-induced interfacial delamination in plastic packages. Experimental investigation by FTIR–MIR measurements with the new calibration method also confirmed higher interfacial moisture content than that at the exposed surface. On the other hand, the effect of interfacial moisture diffusion on adhesion was also investigated by both MD simulation and analysis of the fracture surface in button shear tests using XPS surface analysis.

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