Abstract
The interfacial intermetallic compound growth behavior of Sn-3.0Ag-0.5Cu lead free solder joints with 2.0wt.% ZnO of micrometer was investigated in this study. Solder joints were fabricated in F4N reflow furnace at 255°Cfor less than 5min and thereafter aged at 150°C up to 240h. Results showed that the IMCs layer were almost layer type and grew thicker with extended aging time. The IMCs of Sn-3.0Ag-0.5Cu-2.0ZnO composite solder was diffusion controlled mechanism by diffusion growth kinetics analysis, moreover, the diffusion coefficient of Sn-3.0Ag-0.5Cu-2.0Zn0 composite solder was 0.31 μm2/h and smaller than that of Sn-3.0Ag-0.5Cu plain solder, it revealed that ZnO powder can reduced the diffusion coefficient of interfacial intermetallic compound.
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