Abstract
In this study, the interface behavior of an orthotropic thin film bonded imperfectly to an orthotropic substrate is considered. The analytical method employs the integro-differential formulation with the aid of membrane assumption. The loading scenarios include either a constant temperature rise applied to the film or a uniform compressive stress applied to the film edges. The sensitivity of the film stresses as well as the shear stress singularity factor to the different material combination are extracted. The results indicate that the shear stress singularity factor dramatically increases as the delamination length exceeds 50% of the film length. The results of this study would be useful for the design engineers focused in flexible and stretchable electronic devices
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