Abstract
A well understanding of interfacial behavior of film/substrate system is of significant importance in both nature and engineering practice. However, the lack of interfacial analyses of thin films bonded to plastically graded substrates hinders various applications in flexible electronics, biochemistry, automobiles, aerospace and other industries. In the present paper, a bonded model between a thin film and a finite-thickness plastically graded substrate under tensile loading is established. By means of numerical simulation and dimension analysis, the influences of the plastic property, the thickness of the graded layer and the connection type on interfacial stress, plastic deformation and plastic energy are comprehensively investigated. It is found that a higher yield strength ratio of upper surface to lower surface of graded layer improves the loading transmission of the plastically graded layer between the upper film and the underlying homogeneous substrate. The effect of plastically graded properties will be weakened or suppressed when bonding layers are introduced. The present findings should be helpful for the applications of plastically graded materials, and improve the knowledge of interface mechanics.
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