Abstract
Transmission electron microscopy (TEM) has been used to characterize and compare the interfaces of aluminum and copper thin films thermally evaporated on polyethylene-terephthalate (PET). The adhesion of these films measured by a Peel test technique has been correlated with the structure of the metal-polymer interface. No precipitates and a sharp interface have been observed on the Al power laminates yielding the highest adhesion. Some spherical aluminum precipitates inside the polymer are observed when the adhesion of the film is very low. Copper films on PET exhibit lower adhesion than do aluminum films. TEM reveals extended copper slabs inside the polymer. The main conclusion is that the deposited metal and the polymer itself both play an important role in the process of diffusion of the metal on the surface and in the skin of the polymer.
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