Abstract
Thermal fatigue failure of an electronic package usually initiates from the interface of solder joints for the mismatch deformation. Because of the viscoelastic creep properties of the solder, the interfacial stress–strain are intrinsically time dependent. The constitutive relationship of two solder materials, Sn–3Ag–0.5Cu and Pb–5Sn are established by creep test. The thermal-structural analysis of the whole stacked chipset during power on/off cycles are conducted. The time dependent stress–strain singular field at the solder–substance interface are obtained by sub-model technique and the singular field parameters are quantitatively evaluated. Furthermore, the thermal fatigue cracking is experimentally measured, and the singular stresses and strains at the interface are discussed with respect to thermal fatigue failure.
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