Abstract
The heat transfer in copper-carbon flat model systems was studied by frequency dependent photothermal radiometry. A novel approach which relies on the frequency dependence of the photothermal signal phase and amplitude at intermediate frequencies was introduced to determine the thermal interface resistance between the Cu-film and the substrate. The frequency dependent amplitude and phase of the photothermal signals were analyzed in the frame of a model of a one- dimensional heat flow perpendicular to the film plane. The interface resistance of the investigated CuC-sample with a Ti-bonding layer was found to increase by a factor two on heat treatment.
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