Abstract
ABSTRACT Aluminum–copper composite is an attractive candidate for electronic industry and power industry because of excellent electrical and thermal conductivity. In this work, the explosive welding technique was successfully employed to prepare the Al/Cu composite. The interface microstructure morphology was characterized using the optical microscopy (OM), field emission scanning electron microscopy (FSEM) and electron backscatter diffraction (EBSD). Meanwhile, the interface formation evolution process was simulated using smoothed particle hydrodynamics (SPH) method by ANSYS/LS-DYNA software. The experimental results indicated that the joining interface presents a typical wavy structure and formed melted zones in the vortex region. The formation of intermetallic compounds and strong texture were confirmed at the vortex region. The simulation results revealed the interface formation evolution characteristics and mechanism, and obtained a wavy joining interface, which are in good agreement with experimental results.
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