Abstract
Epoxy-impregnated aramid composites, notable for their excellent mechanical and insulation qualities, are pivotal in electrical engineering and electronics. However, their performance is severely restrained by interface issues. This research proposes an effective modification strategy for improving interface property by employing non-thermal atmospheric plasma to introduce active functional groups onto aramid paper. The modified composites demonstrated a 26 % increase in tensile strength and a 20 % enhancement in breakdown strength at best, alongside inhibited charge transport properties and reduced partial discharge under operational electric fields. Molecular simulation suggests that plasma treatment bolsters interface hydrogen bonding, restricting the chain mobility of the resin molecular, and thus augmenting inter-phase compatibility. This study offers a factual perspective on improving resin-impregnated composites, laying a theoretical foundation for advancing high-performance materials in power industries.
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