Abstract
Diamond particle reinforced metal matrix (metal/diamond) composites with high thermal conductivity and tailorable coefficient of thermal expansion are an ideal thermal management material for electronic packaging applications. Interface engineering is the key to designing metal/diamond composites due to large difference between metal and diamond in both chemical and physical nature. In this paper, we briefly summarize recent progress in the interface engineering of metal/diamond composites and give some perspectives on future development in this field.
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