Abstract
The mass transport at the bimetal Au + Ag Si interface during annealing to different temperatures has been studied by photoelectron emission microscopy (PEEM). The lateral evolution of the bimetallic interface, produced by evaporation of a Au patch of a few layers thickness onto an ordered ( √3 × √3) R30°− Ag Si interface, was followed by real-time imaging when passing a direct heating current through the sample. Two processes contributed to the observed mass transport at the interface: thermal migration and electromigration. The variation in the contrast of the PEEM images identified changes in the local work function and density of states caused by the processes controlling interface formation.
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