Abstract
We investigated the influence of annealing conditions on the interface-correlated microstructural evolution and subsequent bonding properties of a warm roll-bonded Ti/Al clad sheet. A TiAl3 intermetallic compound layer with a thickness of 160nm was initially generated at the joint interface between the Ti and Al alloys by warm rolling. When the annealing time and temperature were increased to a maximum of 6h and 650°C, respectively, the thickness of the TiAl3 layer increased to 320nm. The feasible annealing conditions for the optimum bonding strength were within 550°C-6h and 600°C-3h. An improvement in the bonding strength between Ti and Al is strongly correlated with the generation of considerable metallurgical bonding. This is manifested in the zipper-like failure mode that occurs at the TiAl3 joint interface for a layer thickness of less than 300nm.
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