Interface behavior of a bi‐material plate under dynamic loading. Cohesive interface debonding

Abstract

The paper deals with the elastic and cohesive interface behavior of pre‐cracked bi‐material ceramic‐metal structures under dynamic time harmonic load. The shear lag model as well as the Fourier method is applied to find the dynamic response of the considered bi‐material structure, assuming the cohesive interface behaviour, accompanied before of the elastic‐brittle one. In both cases, the growth of debond length is not considered, e.g. at a given loading condition the only corresponding debond length is found. The inertia forces of the already elastic debond parts of the bi‐material structure are neglected. Appropriate contact conditions are proposed in order to fit together both elastic and cohesive solutions. The numerical predictions for the cohesive debond length of the bi‐material structures is calculated by the aid of the corresponding value of the elastic debond length at the same loading condition. The influence of loading characteristics i.e. frequencies and amplitude fluctuations on the debond length and the interface shear stress distribution is discussed. The parametric analysis of the results obtained is illustrated by examples of the modern ceramic‐metal composites on metal substrates and is depicted in figures.